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第五届电气电子与计算机工程技术进步国际学术会议（The Fifth International Conference on Technological Advances in Electrical, Electronics and Computer Engineering）
第五届 电气电子 计算机工程技术 进步 国际学术 会议
2017/5/24
You are invited to participate in The Fifth International Conference on Technological Advances in Electrical, Electronics and Computer Engineering (TAEECE2017) that will be held in Kuala Lumpur, Malay...
MUSEPICK: AN INTEGRATED TECHNOLOGICAL FRAMEWORK TO PRESENT THE COMPLEX OF SANTISSIMA ANNUNZIATA IN ASCOLI PICENO (ITALY)
Digital Cultural Heritage Virtual Reality Web Platform Beacon Micro-location 360° Panoramic Image Immersive Walkthrough 3D model
2017/5/20
Nowadays, digital media play a central role in a shift towards updated modes of communicating knowledge. In addition to this, the tragic recent events related to the long series of earthquakes that ha...
2017IEEE农业和农村发展ICT技术创新国际会议（2017 IEEE Technological Innovations in ICT for Agriculture and Rural Development） (TIAR)
农业和农村发展ICT技术 国际会议
2017/3/27
A majority of the poor in rural areas of the world primarily depend on the wages they earn through unskilled labour. In the event of inadequate labour demand or in the face of unpredictable crises lik...
2017 IEEE通信，控制和自动化技术创新国际会议（2017 IEEE International Conference on Technological Innovations in Communication, Control and Automation）
2017 IEEE通信 控制 自动化技术 创新 国际会议
2017/3/9
Technological Innovations in Communication, Control and Automation (TICCA) 2017 serves as a forum to promote the exchange of the latest advances in Communication, Control and Automation Technologies f...
Photogrammetric scanners-survey, technological developments and requirements
Scanner Technology Photogrammetric Scanner Requirements
2016/5/20
Scanners are necessary for retrieving digital information from analogue imagery. In the context of this paper, scanners as input devices
for softcopy photogrammetric systems, which ask for high radio...
UW scientists create ultrathin semiconductor heterostructures for new technological applications
UW scientists ultrathin semiconductor heterostructures new technological applications
2016/2/12
Heterostructures formed by different three-dimensional semiconductors form the foundation for modern electronic and photonic devices. Now, University of Washington scientists have successfully combine...
TECHNOLOGICAL ASPECTS OF THE 3-DIMENSIONAL PHOTOGRAMMETRIC UPDATING OF THE ISRAELI NATIONAL GIS
3-DIMENSIONAL PHOTOGRAMMETRIC ISRAELI NATIONAL GIS
2015/3/16
TECHNOLOGICAL ASPECTS OF THE 3-DIMENSIONAL PHOTOGRAMMETRIC UPDATING OF THE ISRAELI NATIONAL GIS.
Impact and Friction Sensitivity of Energetic Materials: Methodical Evaluation of Technological Safety Features
energetic materials experimental testing friction sensitivity impact sensitivity regressive analysis safety in use methodical evaluation
2015/3/14
Key methods developed and used in the USSR and in the Russian Federation to determine the impact and friction sensitivity of energetic materials and explosives have been discussed. Experimental metho...
Investments in Energy Technological Change Under Uncertainty
Research and development Technological change Uncertainty
2014/10/21
This dissertation addresses the crucial problem of how environmental policy uncertainty influences investments in energy technological change. The rising level of carbon emissions due to increasing gl...
Optical routing technologies will surely be the key to creating future bandwidth abundant and green networks. Considering future services and the need to create virtual fiber networks, the introductio...
Technological Adaptation in the Transformation of Traditional Boats in the Spermonde Archipelago, South Sulawesi
boatbuilding technology local knowledge Spermonde Archipelago South Sula-wesi
2011/2/18
Although traditional boats and boatbuilding techniques in Indonesia have drawn scholarlyattention, attempts to analyze the technological development in wooden boatbuilding havebeen rarely made. After ...
采用四元二次回归正交旋转试验和响应面分析方法，并利用SPSS 11.5和Matlab 7.1软件研究了成型压力、加热温度、含水率和粘结剂添加量对稻壳成型块松弛密度的影响，建立并分析了稻壳成型块松弛密度的数学模型。结果表明，4个因素对稻壳成型块松弛密度影响次序为：加热温度、含水率、成型压力、粘结剂添加比，最优组合为成型压力10MPa，粘结剂添加比3.5∶1，含水率16%，加热温度100℃，此时成型物...
Technological plasticity and structure in stainless steels during hot-working
Metallic alloys Hot deformation Microstructure
2009/12/14
Purpose: The high-temperature plastic deformation is coupled with dynamic processes of recovery influencing the structure and properties of alloys. One of crucial issues is finding the interdependence...
Influence of LCVD technological parameters on propertiesof polyazomethine thin films
UV-Vis spectroscopy AFM microscopy LCVD
2009/12/14
Purpose: The aim of this paper is to show influence of technological parameters (temperature and gas stream intensity) of low-temperature chemical vapour deposition (LCVD) on optical properties and mo...
Design, manufacture and technological verification of SiC/C composite stirrer
Composites Solidification Thermovision
2009/12/3
Purpose: In article were presented assumptions and choose results of investigations connected with material selection and technology production of prototype’s ceramic stirrer with destination to work ...